作者: Caesar Chen , Edmond Choy
DOI:
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摘要: A system (10) for interconnecting two modules (100, 100') to the CPU chip, includes opposite connectors (12, 14) in a head-to-head arrangement. The traces (200) each of which connects corresponding contacts 28/30 and 30'/28' being located same position connector 14), are generally arranged parallel relationship. One (12) is substantially standard one meets requirements defined general specification. other (14) generally, but not exactly, mirror image with regard first (12), wherein positions two-row (28'/30') housing (16') along lengthwise direction second an relationship those (12). When used, module (100) can be inserted into common way its upside surface (106) facing up, or back (108) whereby pads (P1-P144) printed on both surfaces (106, 108) respectively properly electrically connected regardless it into.