Effect of relative tool sharpness on subsurface damage and material recovery in nanometric cutting of mono-crystalline silicon: A molecular dynamics approach
作者： Seyed Nader Ameli Kalkhoran , Mehrdad Vahdati , Jiwang Yan
DOI: 10.1016/J.MSSP.2019.104868
关键词:
摘要: Depth of cut (h 0) and tool edge radius (re) are two key parameters in nanometric cutting, investigating both of the two parameters simultaneously can provide comprehensive understanding of the cutting mechanism. In this paper, relative tool sharpness (RTS), which is quantified as h 0/re, is employed as a factor to examine the subsurface damage and material recovery in nanometric cutting of mono-crystalline silicon using molecular dynamics (MD) simulation. Various RTS values were generated by changes of cutting depth at …
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