Method of removing a component from a substrate
作者： Donald J. Geralds , Dennis R. Ostendorf
DOI:
关键词:
摘要: A method of removing a component bonded to substrate utilizes fixture having bore therethrough which is aligned with in the substrate. screw advanced cause push pin contact and force away from
lens.org 参考文章(37)
Jerome P. Dattilo, Extraction tool for electronic circuit components ,(1992)
James V. Murphy, Method and apparatus for removing a multi-pin component installed in sockets on a circuit board ,(1989)
Fritz Stahlecker, Shaft for an open-end spinning rotor assembly ,(1993)
John Padrun, Tool for inserting/removing integrated circuit chips ,(1993)
James A. Long, Method for separating spot-welded sheet metal parts ,(1993)
Donald W. Kendall, Reversing and preventing warpage in stringed musical instruments ,(1992)
David Armitage, John I. Thackara, Method for replicating an optical element ,(1987)
Leopoldo Valero, Reusable package for holding a semiconductor chip and method for reusing the package ,(1990)
Edward F. Smith, Anthony M. Pasqualoni, Jacob Crane, Sheldon H. Butt, Deepak Mahulikar, Metal electronic package ,(1988)
Benjamin Thomas Jr Rodini, Charles Louis Thaw, Rodman Arnold Mogle, Carl Henry Zweben, Low thermal expansion,heat conducting laminates having layersof metal and reinforced polymer matrix composite ,(1987)