High density interconnect system for ic packages and interconnect assemblies

摘要: An improved interconnection system is described, such as for electrical contactors and connectors, electronic device or module package assemblies, socket and/or probe card assembly systems. exemplary connector comprises a first structure comprising contactor substrate having contact surface bonding surface, one more electrically conductive micro-fabricated spring contacts extending from the second at least set of pad located on corresponding to contacts, means movably positioning aligning between position position, that in connected pad.