Electrically conductive composites based on epoxy resin with polyaniline-DBSA fillers
作者： W. Jia , R. Tchoudakov , E. Segal , R. Joseph , M. Narkis
DOI: 10.1016/S0379-6779(02)00460-5
关键词:
摘要: A conductive epoxy-anhydride system containing polyaniline (PANI)-dodecylbenzenesulfonic acid (DBSA) has been developed and characterized. Two forms of PANI-DBSA, powder paste (containing excess DBSA), have shown that DBSA in the contributes to improved dispersion PANI-DBSA resin, thus a lower percolation threshold is found. Excess DBSA, however, retards curing reaction epoxy/hardener system, but this deficiency can be remedied by using higher accelerator concentrations. Similar trends were found incorporation coated mica particles, engulfed particles result much compared or paste. SEM observation provides useful information for understanding conductivity behavior epoxy systems. Significantly different morphologies are observed dispersed matrix.
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