Wafer level mems force dies

摘要: A composite wafer level MEMS force dies including a spacer coupled to sensor is described herein. The includes at least one flexible sensing element, such as beam or diaphragm, which have more elements formed thereon. Bonding pads connected the are placed on outer periphery of sensor. spacer, protects element and wire bonding pads, bonded For version, bond implemented edges die. diaphragm in center An interior gap between allows deflect. can also be used limit amount deflection order provide overload protection.