Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactors
作者： Ajit Balakrishna , Jason Della Rosa , Sergio Fukuda Shoji , Hamid Noorbakhsh , Jong Mun Kim
DOI:
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摘要: Embodiments of the present invention provide apparatus and methods for reducing non-uniformity and/or skews during substrate processing. One embodiment provides a flow equalizer assembly disposing between vacuum port processing volume in chamber. The equalizing includes first plate having at least one opening, second two or more openings. plates define redistributing therebetween, opening openings are staggered.
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