Systems and methods for providing electromagnetic interference shielding for integrated circuit modules
作者： Luis Eduardo Herrera , Matthew Sean Read , Hoang Mong Nguyen , Sergio Joaquin Gonzalez
DOI:
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摘要: Systems and methods disclose maintaining paint thickness uniformity over the surface of a cap encapsulating at least one integrated circuit (!C) module on panel IC modules. The layer conductive electrically couples with wirebonds to form part an electromagnetic interference (EMI) or radio frequency (RFI) shield that attenuates EMI RFS during operation module. Optimizing spray nozzle diameter, fluid pressure, coaxial air heights, speeds, pattern achieves control. A uniform coating provides more effective RFI
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