Self-annealing characterization of electroplated copper films
作者： S Lagrange , S.H Brongersma , M Judelewicz , A Saerens , I Vervoort
DOI: 10.1016/S0167-9317(99)00314-7
关键词:
摘要: … been observed for these two film characteristics, indicating that other … molecules incorporated in the copper film from the bath … For a typical 1-μm thick copper film, the sheet resistance is …
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D. S. Stoychev, I. V. Tomov, I. B. Vitanova, Recovery and recrystallization of electrodeposited bright copper coatings at room temperature. I: Microhardness in relation to coating structure Journal of Applied Electrochemistry. ,vol. 15, pp. 879- 886 ,(1985) , 10.1007/BF00614363
B. M. Hogan, J. A. Roth, Microstructural stability of copper electroplate Presented at the American Electroplaters' Society SUR/FIN 1984 Conf. pp. 16- ,(1984)