Multilayer electrical interconnection device and method of making same
作者： David Robert Collins , David John Klassen , Thomas Randall Peterman , Morgan Merritt Whitney , Paul Earl Pergande
DOI:
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摘要: A multilayer, monolithic electrical interconnection device includes a substrate and plurality of overlaying, alternating conducting insulating layers deposited atop the one another. The are by thermal spraying respective or material through defined apertures in spray masks. Interlayer connections intrinsically formed direct metallurgical bonding between an overlaying layer previously sprayed layer.
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