Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs)
作者： Jooyoung Lee , Seokkan Ki , Donghyun Seo , Jaechoon Kim , Youngsuk Nam
DOI: 10.1016/J.APPLTHERMALENG.2020.115230
关键词:
摘要: … of the previous-reported direct liquid cooling solutions such as the jet … cooling solutions for high power semiconductor applications such as an insulated gate bipolar transistor (IGBT…
sci-hub.se 参考文章(45)
Varaprasad Venkata Calmidi, Transport phenomena in high porosity fibrous metal foams UMI, c1998. ,(1998)
K. Steinbrecher, B. Diedrichs, Steady and transient conjugate heat transfer modelling of IGBTS subjected to liquid cooling by a membrane heat sink for rolling International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics. ,(2014)
Yasuyuki Sakai, Hiroshi Ishiyama, Takaji Kikuchi, Power Control Unit for High Power Hybrid System SAE World Congress & Exhibition. ,(2007) , 10.4271/2007-01-0271
N.G. Hingorani, Power electronics in electric utilities: role of power electronics in future power systems Proceedings of the IEEE. ,vol. 76, pp. 481- 482 ,(1988) , 10.1109/5.4432
C.Y. Zhao, W. Lu, S.A. Tassou, Thermal analysis on metal-foam filled heat exchangers. Part II: Tube heat exchangers International Journal of Heat and Mass Transfer. ,vol. 49, pp. 2762- 2770 ,(2006) , 10.1016/J.IJHEATMASSTRANSFER.2005.12.014
A.Z. Vaszi, L. Elliott, D.B. Ingham, I. Pop, Conjugate free convection from a vertical plate fin with a rounded tip embedded in a porous medium International Journal of Heat and Mass Transfer. ,vol. 47, pp. 2785- 2794 ,(2004) , 10.1016/J.IJHEATMASSTRANSFER.2004.01.001
C. Hutter, D. Büchi, V. Zuber, Ph. Rudolf von Rohr, Heat transfer in metal foams and designed porous media Chemical Engineering Science. ,vol. 66, pp. 3806- 3814 ,(2011) , 10.1016/J.CES.2011.05.005
Vivek Sahu, Yogendra K. Joshi, Andrei G. Fedorov, Je-Hyeong Bahk, Xi Wang, Ali Shakouri, Experimental Characterization of Hybrid Solid-State and Fluidic Cooling for Thermal Management of Localized Hotspots IEEE Transactions on Components, Packaging and Manufacturing Technology. ,vol. 5, pp. 57- 64 ,(2015) , 10.1109/TCPMT.2014.2332516
Nihad Dukhan, Özer Bağcı, Mustafa Özdemir, Thermal development in open-cell metal foam: An experiment with constant wall heat flux International Journal of Heat and Mass Transfer. ,vol. 85, pp. 852- 859 ,(2015) , 10.1016/J.IJHEATMASSTRANSFER.2015.02.047
Y. Celnikier, L. Dupont, E. Hervé, G. Coquery, L. Benabou, Optimization of wire connections design for power electronics Microelectronics Reliability. ,vol. 51, pp. 1892- 1897 ,(2011) , 10.1016/J.MICROREL.2011.06.058