Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin
作者： Douglas W. Romm , Donald C. Abbott
DOI:
关键词:
摘要: A leadframe for use with integrated circuit chips comprising a base metal having plated layer of nickel fully covering said metal; pure tin on layer, selectively areas intended attachment to other parts; and palladium bonding wire attachment.
google.co.uk 参考文章(13)
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