Future Trend of Advanced Thermal Management Materials

摘要: The R&D work in advanced thermal management materials is active and ongoing. It difficult to cover all related research results. In this chapter, we select a few common used microelectronics packaging review future trends. While most material typically of homogeneous structure, Cu/Mo70Cu/Cu not. As discussed an earlier (typically at 1:4:1 ratio) has coefficient expansion the X-direction 7.2 ppm/°C 9.0 ppm/°C. was successfully for long die attaches such as laterally diffused metal-oxide semiconductor. Within realm composite materials, carbon nanotubes aluminum matrix (with graphite or SiC) have attracted lot interest due their potential properties. Lastly, development injection moldable polymer also reviewed.