Effect of temperature on isothermal low cycle fatigue properties of Sn-Ag eutectic solder
作者： C Kanchanomai , Y Mutoh
DOI: 10.1016/J.MSEA.2004.04.018
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摘要: Abstract Low cycle fatigue tests on as-cast Sn–Ag eutectic solder (96.5Sn–3.5Ag) were carried out using the non-contact strain-controlled system at 0.1 Hz under various temperatures (20, 85, 120 °C). The relationship between stress range first and inverse temperature for strain ranges followed Dorn’s equation with activation energy in of 62–72 kJ/mol, which suggests that pipe-diffusion-controlled dislocation climb are main deformation mechanism. low behavior this Coffin–Manson equation. ductility coefficient was found to be influenced by temperature. Steps boundaries Sn-dendrites initiation sites microcracks all studied. link up these cracks crack propagation inside specimen occurred both transgranularly through phase and/or Sn dendrite, intergranularly along Sn-dendrite boundaries. Propagation stage II different could characterized C * -parameter.
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