作者: P.N. Kalu , D.R. Waryoba
DOI: 10.1016/J.MSEA.2007.01.124
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摘要: Abstract The microstructure of heavily drawn wire is inhomogeneous and subsequent annealing the material results in recrystallization. Standard JMAK analysis kinetics recovery recrystallization for such cumbersome sometimes unreliable. This investigation was carried out on (to true strain 2.31) oxygen free high conducting (OFHC) copper, which subsequently annealed at 250, 400 500 °C times ranging from 10 s to 1 h. microstructural changes during were characterized by optical scanning electron microscopy, orientation imaging microscopy (OIM) microhardness. While standard can be used analyze grain growth, it inadequate quantifying kinetics. However, modified JMAK-microhardness model developed enabled us evaluate recovery, using a single equation. In this approach, expressed terms microhardness data, parameters different restoration determined. values exponent, n , temperature-dependent constant, k activation energy, Q growth obtained new method compared well with literature.