Printed circuit board housing clamp

作者: Glenn Stewart , Kristopher Frutschy , Geoffrey Reid , Farzaneh Yahvaei-Moayyed

DOI:

关键词:

摘要: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current an integrated circuit (IC) package (308). The attached a printed (PC) board (312), supplies the IC over clamp, and receives returned from another clamp. Each clamp contacts contact pad (330) on surface of PC board, (334) top package. Vias (338, 339) planes (340, 342) within then carry (e.g., 306) connected In embodiment, (904, 9) holds structure (902) in place between (908) (914), is carried primarily structure, rather than

参考文章(15)
Arthur Bross, George Czornyj, Umar M. U. Ahmad, Richard R. Jones, Harry K. Harrison, Array of pinless connectors and a carrier therefor ,(1993)
Michael P. Brownell, Compliant hinge clip attachment ,(1996)
George John Saxenmeyer, David William Dranchak, Thomas George Macek, Fletcher William Chapin, Raymond Archie Busacco, James Ralph Petrozello, Rod Alan Smith, Chi Shih Chang, High density connector ,(1993)
Paul T. Lin, Michael B. McShane, Howard P. Wilson, Packaged semiconductor device having a low cost ceramic PGA package ,(1990)
Bruce G. Kosa, Scott S. Simpson, Richard T. Traskos, Jeffrey B. Otto, Mark S. Zifcak, Richard C. Berry, Herman B. Gordon, Claudette M. Hoffman, Electrical circuit board interconnect ,(1987)
David William Dranchak, Robert Joseph Kelleher, Patrick Robert Zippetelli, David Peter Pagnani, Dual substrate package assembly coupled to a conducting member ,(1996)
Lawrence F. Cygan, Raul Olivera, John F. Pottle, Grounding and positioning clip for a power transistor ,(1983)