The Adhesion of Metal/Alumina Interfaces

摘要: Cylinders of copper and nickel have been melted under various conditions to form sessile drops on alumina plaques. The resultant metal/ceramic adhesion at room temperature has measured using the commonly adopted test in which are pushed off ceramic stress system involved analysed it shown that standard interpretation test, as a measure interfacial shear strength, is not valid; revised makes tension. Results for Cu/Al2O3 Ni/Al2O3 systems show non-wetted interfaces can be strong strengths independent contact-angle changes caused by wetting-temperature variations.