Integrated millimeter wave antenna and transceiver on a substrate

摘要: A semiconductor chip integrating a transceiver, an antenna, and receiver is provided. The transceiver located on front side of substrate. through substrate via provides electrical connection between the backside antenna connected to in dielectric layer separation reflector plate about quarter wavelength millimeter waves, which enhances radiation efficiency antenna. An array vias may be employed reduce effective constant material plate, thereby reducing wave enhance efficiency. design structure for designing, manufacturing, or testing such also