ToF-SIMS 3D Analysis of Thin Films Deposited in High Aspect Ratio Structures via Atomic Layer Deposition and Chemical Vapor Deposition.
作者： Alireza M. Kia , Nora Haufe , Sajjad Esmaeili , Clemens Mart , Mikko Utriainen
DOI: 10.3390/NANO9071035
关键词:
摘要: … in the semiconductor industry, introduce a true challenge for thin … the challenges of elemental analysis in high aspect ratio … be done line by line via “cleaning cross section thinning” mode …
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