Materials and methods for stress reduction in semiconductor wafer passivation layers
作者： Farhad G. Mizori , James T. Huneke , Stephen M. Dershem
DOI:
关键词:
摘要: The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods fabricating thereof. further a device that includes wafer layer disposed on the surface of wafer, wherein comprises such polymers.
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