作者: I. J. Hodgkinson , Peter W. Wilson
DOI: 10.1080/10408438808244624
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摘要: Abstract Materials in thin-film form are much more interesting or trouble than their bulk counterparts, depending on your point of view. Most coatings deposited at substrate temperatures considerably lower the melting points evaporant materials, and trend is generally toward even processing temperatures. In these films, solid material distributed an array fairly closely packed columns that run perpendicular to substrate, it columnar microstructure has substantial influence over physical behavior films. The anisotropic so most thin film properties.