Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder
作者： Yilun Xu , Tianhong Gu , Jingwei Xian , Finn Giuliani , T. Ben Britton
DOI: 10.1016/J.IJPLAS.2020.102904
关键词:
摘要: Abstract The creep behaviour of directionally solidified SAC305 (96.5Sn-3Ag-0.5Cu wt%) alloy has been investigated with integrated particle matrix composite (PMC) crystal plasticity modelling and quantitative experimental characterisation test. In this manuscript, the mechanistic basis rate dependence is shown to be influenced by plastic strain gradients, associated hardening due geometrically necessary dislocation (GND) density. These gradients are created heterogenous deformation at β-Sn phase intermetallic compound (IMCs) boundaries. size distribution IMCs important, as finer well dispersed leading higher resistance lower rates, agrees observations. This understanding enabled creation a new microstructurally homogenised model which captures link between GND hardening, size, corresponding rate. relates rates microstructure found within solder they evolve in service, when ageing coarsening kinetics known.
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