Micromachining methods and systems
作者： Shen Buswell
DOI:
关键词:
摘要: A method of forming fluid handling slots in a semiconductor substrate having thickness defined by first side and second is provided. The comprises ultrasonic grinding, utilizing an abrasive material, into the from to form trench, removing material backside wherein at least portion trenches intersect feature through substrate.
lens.org 参考文章(18)
Frank Randolph Bryant, Paul I. Mikulan, Simon Dodd, Devices and methods for integrated circuit manufacturing ,(2005)
Gerard J. MacNeil, David B. MacNeil, Refractory material removal system and method ,(2011)
Bertrand Paris, Integrated thermo-optical silica switch ,(2000)
Kenneth E. Trueba, Ellen R. Tappon, Kit C. Baughman, Jeffrey A. Kahn, Paul H. McClelland, Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining ,(1993)
Jeffrey S Obert, Eric L Nikkel, Jeffrey R Pollard, Jeremy Donaldson, Jeffery S Hess, Slotted substrates and methods and systems for forming same ,(2003)
Teruo Canon Kabushiki Kaisha Ozaki, Shuji Canon Kabushiki Kaisha Koyama, Shingo Canon Kabushiki Kaisha Nagata, Method for manufacturing liquid discharge head, substrate for liquid discharge head and method for working substrate ,(2002)
Derek J. Dawson, Tools for working non-metallic hard materials ,(1990)
Robert Clark, Neil Muncey, Ultrasonic seam bonding method and apparatus ,(1999)
Tadahiro Haranaka-Shataku Kato, Sadayuki Ryokuhu-Ryo C Ohkuni, Hideo Aza-Sugiyama Kurdo, Method and apparatus for surface-grinding of workpiece ,(1995)