Furnace body for cooling rapidly

摘要: The invention relates to the technical field of semiconductor manufacturing equipment and in particular a furnace body for cooling rapidly. A longitudinal air duct transverse duct, which extend axial circumferential directions respectively, are arranged heat preservation layer body, an annular grooved inlet ring is on block at bottom formed ring, communicated with inlet, one end other chamber outlet. can achieve high speed due process time be shortened, filming quality ensured production cost reduced.