Molecular dynamics simulation of dislocation evolution and surface mechanical properties on polycrystalline copper

摘要: During the nanofabrication process of polycrystalline materials, interactions dislocations in material determine evolution subsurface defects. In this paper, molecular dynamics simulation models nanocutting copper, which is used to study relationship between crystal structure and cutting force during process, were established, transformation grain boundaries was studied get effects boundary on dislocation slip stress conduction. The results show that there are obvious rules can prevent shielding influence different parameters defects workpiece further analyzed. Finally, nanoindentation simulations experiments carried out surface mechanical properties workpiece. It found some extent, hardening effect remarkable with depth increase.