Interface Apparatus for Semiconductor Testing and Method of Manufacturing Same

作者: Kothandan Shanmugam , Christine Bui , Lim Hooi Weng , Hai Dau

DOI:

关键词:

摘要: In one embodiment, the present invention includes an interface apparatus for semiconductor testing. The a housing. housing lower substrate and upper substrate. has plurality of apertures arranged according to fine pitch, coarse pitch. A wires passes through from Each wire plated conductive ends emanating opposing sides corresponds transforms pattern having course pitch

参考文章(38)
Yung Hsin Kuo, Test probe structure ,(2009)
Barry R. Benschoter, Robert F. Benschoter, Stephen N. McEwen, Robert L. Stevens, Trough manufacturing process ,(1981)
Kiyoshi Adachi, Masanori Yagi, Socket and contact of semiconductor package ,(2002)
Michael J. Armstrong, Li Fan, John K. Gritters, Process of positioning groups of contact structures ,(2008)
Kishor Desai, Belgacem Haba, Low cte interposer ,(2014)