Influence of graphene content and nickel decoration on the microstructural and mechanical characteristics of the Cu/Sn–Ag–Cu/Cu soldered joint
作者： R. Sayyadi , F. Khodabakhshi , N. Shahamat Javid , G. Khatibi
DOI: 10.1016/J.JMRT.2020.06.026
关键词:
摘要: … is assessed by using the eutectic composition of Sn-3.5Ag-0.7Cu (SAC, wt%) solder alloy … (IMC) layers at the interface between the Cu-substrate and solder material was found very …
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