Chip device and method for producing the same
作者： Hajima Kuwajima , Masashi Gotoh , Jitsuo Kanazawa
DOI:
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摘要: In a chip device in which not only an electrode pattern 25 is provided on main mounting surface 21 of base but also bump electrodes 22 are as external for face-down mounting, electrically insulating layer 31 to be put at least part the so remain edge portions do cover 25, and protection 32 protecting further distance from 31, that connected while being contact with 32.
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