Vapor bonding method

摘要: VAPOR BONDING METHOD ABSTRACT OF THE DISCLOSURE Components, printed circuit board assemblies and the like to be interconnected by soldering are appropriately fluxed placed in an atmosphere of a saturated vapor derived from heat transfer liquid medium having boiling point above melting solder. The is chosen have solubility parameter compatible with solu-bility flux eliminate need for subsequent cleaning. An alternate embodiment includes fatty acid medium, which under some circum-stances can apply assembly being soldered.