作者: F. Dalla Torre , H. Van Swygenhoven , R. Schäublin , P. Spätig , M. Victoria
DOI: 10.1016/J.SCRIPTAMAT.2005.03.026
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摘要: Tensile properties and microstructure of Danocrystalline electrodeposited Ni at temperatures between room temperature 330D C are presented. Above 300D low flow stress high tensile elongation observed along with grain growth segregation sulphur to the boundaries causing formation a Ni-sulphide phase. © 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.