Silver thick film paste hermetically sealed by surface thin film multilayer
作者： Joseph Ambrose Wolf , Kenneth A. Peterson
DOI:
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摘要: A ceramic substrate comprises a plurality of sheets, inner conductive layers, vias, and an upper layer. The sheets are stacked one on top another include sheet. layers electrically material that forms features surface each sheet excluding the vias formed in with via being filled material. layer includes is constructed from stack four sublayers. first sublayer titanium. second copper. third platinum. fourth gold.
lens.org 参考文章(37)
Mukta S. Farooq, Herbert I. Stoller, Harvey C. Hamel, Robert A. Rita, High k dielectric capacitor with low k sheathed signal vias ,(1998)
Shaul Branchevsky, Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrate ,(2000)
Galeb H. Maher, Low temperature fired electrical components and method of making same ,(1971)
Mamoru Uchida, Layered board, and apparatus incorporated such layered board ,(2003)
Satoru Yuhaku, Yoshihiro Bessho, Minehiro Itagaki, Kazuhiro Miura, Yoshifumi Nakamura, Yasuhiko Hakotani, Ceramic substrate and manufacturing method thereof ,(1994)
Glenn A. Pomerantz, James G. Balz, Richard Indyk, Lori A. Maiorino, Richard P. Surprenant, Brian R. Sundlof, Patrick E. Spencer, Michael Berger, Jon A. Casey, Donald R. Wall, David C. Long, Mark LaPlante, Arthur G. Merryman, Charles Hendricks, Krystyna W. Semkow, Robert A. Rita, Thomas A. Wassick, Kathleen M. Wiley, Jerome Cohen, Electronic package repair process ,(2005)
Koji Yamanaka, Motoyoshi Koyanagi, Hiroshi Otsuka, Akira Ota, Shohei Imai, Hiroaki Maehara, High-frequency power amplifier ,(2004)
Jeremy W. Burdon, Joyce K. Yamamoto, Miniaturized co-fired electrical interconnects for implantable medical devices ,(2006)
Shinsuke Yano, Susumu Nishigaki, Hiroshi Corpo Tokai Kawabe, Toshio Nonomura, Multilayer ceramic substrate with circuit patterns ,(1987)