Leadless chip placement machine for printed circuit boards

摘要: Described is a machine for pre-gluing raw circuit surfaces of printed boards (P.C. boards) at an adhesive station and properly positioning the P.C. placement leadless electronic components (chips) onto adhesive. A carousel provides program preselected vertical supply taped to feeder assembly which feeds individual chips nozzle turret-type vacuum head pick-up station. The has four nozzles spaced 90° apart about central axis head. As turret rotated, chip transported by nozzle, sequentially, from centering testing station, orienting Located between stations removal ejecting defective or inverted chips. Sensors are located detect so that they may be bypassed. controller, such as digital computer, additional monitoring controls operation machine.