Impulse Pressuring Diffusion Bonding of Titanium to Stainless Steel Using a Copper Interlayer
作者： Deng Yongqiang , Sheng Guangmin , Yin Lijing
DOI: 10.1016/S1875-5372(15)30063-1
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摘要: Abstract Impulse pressuring diffusion bonding of commercially pure titanium to 1Cr18Ni9 stainless steel was carried out using a copper interlayer in an attempt reduce the time and alleviate detrimental effect interfacial reaction products on strength. Successful has been achieved at 850 °C under pulsed pressure 8∼20 MPa within duration only 120∼180 s, which is notably shortened comparison with conventional bonding. Microstructure characterization revealed that sequence Ti-Cu intermetallic compounds were formed Ti/Cu interface Cu/stainless characterized by presence solid solution Cu γ Fe without any products. Maximum strength 346 obtained when joint bonded for 120 s. Upon tensile loading, joints fractured along layer brittle cleavage manner, indicating impulse can harmful influence performances certain extent, but it infeasible completely eliminating negative compounds.
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