Stress in Nickel Electrodeposits

作者: T. P. Hoar , D. J. Arrowsmith

DOI: 10.1080/00202967.1959.11869764

关键词:

摘要: The stress developed in nickel electrodeposits from the earliest stages up to stage of steady production has been continuously measured, for a plain Watts bath and baths containin...

参考文章(9)
C. GURNEY, Surface tension in liquids. Nature. ,vol. 160, pp. 166- 167 ,(1947) , 10.1038/160166A0
T. P. Hoar, R. D. Holliday, The inhibition by quinolines and thioureas of the acid dissolution of mild steel Journal of Chemical Technology & Biotechnology. ,vol. 3, pp. 502- 513 ,(2007) , 10.1002/JCTB.5010031105
H. J. PICK, Growth Spirals in Electrodeposited Copper Nature. ,vol. 176, pp. 693- 693 ,(1955) , 10.1038/176693A0
A.H Cottrell, Theory of dislocations Progress in Metal Physics. ,vol. 1, pp. 205- 264 ,(1949) , 10.1016/0502-8205(49)90004-0
D. V. ATTERTON, T. P. HOAR, Surface tension of liquid metals. Nature. ,vol. 167, pp. 602- 602 ,(1951) , 10.1038/167602A0
F. C. Frank, The influence of dislocations on crystal growth Discussions of The Faraday Society. ,vol. 5, pp. 48- 54 ,(1949) , 10.1039/DF9490500048
Henry Leidheiser, Studies of the Action of Organic Compounds at the Surface During the Electrodeposition of Nickel Transactions of The Institute of Metal Finishing. ,vol. 31, pp. 207- 222 ,(1954) , 10.1080/00202967.1954.11869638
A.H. Cottrell, Theory of dislocations Progress in Metal Physics. ,vol. 4, pp. 205- 264 ,(1953) , 10.1016/0502-8205(53)90018-5