Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds

摘要: A three-dimensional circuit structure that interconnects an integrated chip, along with additional active devices and passive components to a substrate by way of high density multichip interconnect decal disposed on the chip. The thus comprises substrate, attached top circuit. One or more relatively small are decal. plurality three-bond, daisy-chained wedge bonds used HDMI Each bond wire initiates at pad, intermediate stitch terminates pad.