Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation: Design, simulations, technology and experiments

作者: G. Schondelmaier , S. Hartmann , D. May , A. Shaporin , S. Voigt

DOI: 10.1109/EUROSIME.2013.6529967

关键词:

摘要: For properties characterization of nanostructured materials and simultaneously to predict their reliability a tensile testing system consisting thermal actuator lateral nano-Newton force piezoresistive sensor is presented. The implementation load in MEMS-based can be regarded as an innovative ultrasensitive method continuously observe the specimen deformation while measuring applied electronically with resolution. primary technique that we have used for fabrication these systems Bonding Deep Reactive Ion Etching (BDRIE) on SOI wafers.

参考文章(7)
Dominik J Bell, TJ Lu, Norman A Fleck, Simon M Spearing, None, MEMS actuators and sensors: observations on their performance and selection for purpose Journal of Micromechanics and Microengineering. ,vol. 15, ,(2005) , 10.1088/0960-1317/15/7/022
Markus Gnerlich, Susan F. Perry, Svetlana Tatic-Lucic, A submersible piezoresistive MEMS lateral force sensor for a diagnostic biomechanics platform Sensors and Actuators A-physical. ,vol. 188, pp. 111- 119 ,(2012) , 10.1016/J.SNA.2012.05.033
T. R. Hart, R. L. Aggarwal, Benjamin Lax, Temperature Dependence of Raman Scattering in Silicon Physical Review B. ,vol. 1, pp. 638- 641 ,(1970) , 10.1103/PHYSREVB.1.638
Shih-Chi Chen, Martin L. Culpepper, Design of Contoured Thermomechanical Actuators and Pulsing Actuation to Enhance Dynamic Performance IEEE\/ASME Journal of Microelectromechanical Systems. ,vol. 21, pp. 340- 349 ,(2012) , 10.1109/JMEMS.2011.2175365
Y. Zhu, H. D. Espinosa, An electromechanical material testing system for in situ electron microscopy and applications Proceedings of the National Academy of Sciences of the United States of America. ,vol. 102, pp. 14503- 14508 ,(2005) , 10.1073/PNAS.0506544102
Karla Hiller, Matthias Kuechler, Detlef Billep, Bernd Schroeter, Marco Dienel, Dirk Scheibner, Thomas Gessner, Bonding and deep RIE: a powerful combination for high-aspect-ratio sensors and actuators Micromachining and microfabrication process technology. Conference. ,vol. 5715, pp. 80- 91 ,(2005) , 10.1117/12.591509
Yong Zhu, Alberto Corigliano, Horacio D Espinosa, A thermal actuator for nanoscale in situ microscopy testing: design and characterization Journal of Micromechanics and Microengineering. ,vol. 16, pp. 242- 253 ,(2006) , 10.1088/0960-1317/16/2/008