Investigation of under bump metallization systems for flip-chip assemblies
作者： Poi Siong Teo , Yu-Wen Huang , Chih Hang Tung , M.R. Marks , Thiam Beng Lim
关键词:
摘要: The objective of this work was to investigate the quality Under Bump Metallization (UBM) systems used for solder bump flip chip applications. These three commercial UBM were (i)Al/NiV/Cu with print-and-reflow solder, (ii)Ti-W/Cu electroplated and (iii) Electroless Ni/Au solder. an eutectic Sn/Pb composition. in terms thermal stability, corrosion-resistance thermal-mechanical reliability investigated using various multiple reflow passes, high temperature storage, pressure cooker test cycling. Analytical tools such as Scanning Electron Microscopy (SEM), Transmission (TEM) Energy Dispersive X-ray Spectrometry (EDS) analyze metallurgy reactions failure modes. This study showed that none out-performed other two all aspects tests conducted.
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