Interconnections including multi-layer metal film stack for improving corrosion and heat resistances
作者： Satoshi Doi
DOI:
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摘要: A method of fabricating a semiconductor device including an interconnection is provided. The composed covering substrate with metal film stack lower refractory over the substrate, protective layer first compound disposed on upper surface film, core layer, second and patterning stack; forming side third patterned film.
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