作者: Patrick Leahey , Robert E. Ryan , Jerry C. Chen , Brian Hatcher , Timothy Driscoll
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摘要: The disclosure relates to a closed-loop, dome thermal control apparatus (100) containing high-volume fan (106), heat exchange chamber (114), and an enclosure (130), that encloses the fan and heat exchange chamber. blows air over dome (102), of semi-conductor wafer processing system and through uniformly control temperature dome plasma chamber to prevent particle contamination wafer. The enclosure recirculates controlled air to form closed-loop apparatus.