作者: T.W. Law , C.K. Liu , P.L. Cheng , I.T. Chong , D.C.C. Lam
DOI: 10.1109/ECTC.2002.1008340
关键词:
摘要: For embedded capacitor application, only dielectric materials with low processing temperature can be applied to printed wiring board manufacturing. Low processable polymer/ceramic composites have been investigated meet this need. The constant is a function of matrix and filler behavior, the highly filled theoretically limited by value polymer matrix. In investigation, we developed new amorphous for use in composites. processed at 300/spl deg/C was characterized 30. At deposited thickness 0.5 /spl mu/m, capacitance density pure film reach 1500pF/mm/sup 2/ before addition high filler.