Bulk metallic glass solder material

摘要: High strength, reliable bulk metallic glass (BMG) solder materials formed from alloys possessing deep eutectics with asymmetric liquidous slopes. BMG are stronger and have a higher elastic modulus than, therefore less likely than crystalline to damage fragile low k interlayer dielectric (ILD) due thermal stress in different coefficients of expansion (CTE). may physically, electrically, or thermally couple feature another feature, any combination thereof. For example, an embodiment the invention, material physically electrically electronic component printed circuit board. In integrated heat sink semiconductor device. Many embodiments also lead-free, so they comply lead-free product requirements, while providing better solution other such as tin-silver-copper.