摘要: A miniaturized laser package includes a modern LDP, modified to accept solid state microchip assembly pumped by the diode laser. The is added standard LDPs containing diodes mounted on heatsinking shelves affixing second shelf mount and heatsink assembly. Standard packages described in invention include 9 mm 5.6 packages, all of which are characterized small dimensions, well sealed housing, robust mounting features, known materials, economical production, techniques characteristic semiconductor processing industry.
lens.org参考文章(46)
Maurice A. Pessot, David E. Hargis, Single cavity solid state laser with intracavity optical frequency mixing ,(1996)
Roger C. Farmer, Cryogenic cooling apparatus employing heat sink and diffuser plate for cooling small objects ,(1995)
David C. Brown, Total internal reflection thermally compensated rod laser ,(1998)
Patrick J. McCann, High temperature semiconductor diode laser ,(1994)
George J. Dixon, Signal-resonant intracavity optical frequency mixing ,(1991)
Engin Molva, Corinne Borel, Bernard Ferrand, Philippe Thony, Solid microlaser passively switched by a saturable absorber and its production process ,(1998)
Brian Lee Peterson, Clark Emory Tooly, Microlaser cavity assembly and associated packaging method ,(2002)
Eric C. Honea, Luis E. Zapata, Raymond J. Beach, Stephen A. Payne, Method for optical pumping of thin laser media at high average power ,(2001)
Wilhelm A. Jordan, Hanna J. Hoffman, Norman Hodgson, Diode-pumped solid-state thin slab laser ,(2002)
Camille Bibeau, Eric Honea, Steven B. Sutton, Scott Mitchell, Raymond J. Beach, Isaac Bass, Helmuth E. Meissner, Laser rods with undoped, flanged end-caps for end-pumped laser applications ,(1998)