Electric device improves bonds of simplified etch-and-rinse adhesives.
作者： Guido Pasquantonio , Franklin R. Tay , Annalisa Mazzoni , Pietro Suppa , Alessandra Ruggeri
DOI: 10.1016/J.DENTAL.2006.03.009
关键词:
摘要: Objectives. This study investigated the effects of an electric field produced by a new device for application etch-and-rinse adhesives on demineralized dentin surfaces. Methods. Three simplified (Single Bond, Prime&Bond NT and OneStep) were applied with compared controls prepared disposable sponges. Specimens processed microtensile bond strength test nanoleakage investigation using high resolution SEM. Results. Microtensile testing revealed higher strengths (p < 0.05) all tested when electricity was used. Adhesive interfaces impulses exhibited very homogenous hybrid layers minimal controls. Significance. The use electronic during may increase adhesive adaptation to substrate improve hybridization due modifications induced organic matrix.
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