摘要: Dynamic mechanical analysis, thermogravimetric and dielectric analysis (DEA) were conducted for three thermoset resin systems: bismaleimide, epoxy, vinyl ester. The samples subjected to various degrees of thermal exposure (400, 270, 330°C 5–150 min). Dielectric constants measured along with the thermomechanical properties. glass-transition temperature, modulus, weight loss important parameters correlating material property changes heat exposure. A linear relation was determined between properties resins under selected conditions. Therefore, DEA can be introduced as a significant technique evaluating thermally exposed polymer materials. Interestingly, it is nondestructive evaluation process. In future, could used onsite health monitoring matrix composite structures. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci,
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