Spreading Resistance in Cylindrical Semiconductor Devices

摘要: For cylindrical semiconductor components, computation of spreading resistance is considered a boundary value problem the solid circular cylinder. Solutions this may be used, for example, to characterize thermal within package device, electrical in mesa type parametric diode, and extrinsic collector transistor. Equations describing (or electrical) are presented graphical form range geometrical parameters applicable many practical situations. Further, examples given potential distribution each structure analysis.