Pass-through 3d interconnect for microelectronic dies and associated systems and methods
作者： Kyle K. Kirby , David S. Pratt , Dewali Ray
DOI:
关键词:
摘要: Pass-through 3D interconnects and microelectronic dies systems of stacked that include such are disclosed herein. In one embodiment, a system includes first die having substrate, metal substrate pad, integrated circuit electrically coupled to the pad. A pass-through interconnect extends between front back sides including through The is isolated from pad second attached side substrate. another memory device device, uses as part an independent communication path device.
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