Method and apparatus for peeling protective adhesive tape from semiconductor wafer

摘要: A method and an apparatus for peeling a protective adhesive tape (3) from work which is semiconductor wafer (W) with attached to the (W). The held on ring-shaped frame (F) via support (1). Thin plates (4) having non-adhesive upper surfaces are stuck portions of (1) peel-starting peel-finishing ends (3a, 3b) sides so as provide regions where contact (5) wound around attaching roller (8) avoided. then end (8), rollers (6-8) moved horizontally (A), whereby peeled together surface