Flat speaker apparatus with heat dissipating structure and method for heat dissipation of flat speaker
作者： Kuan-Wei Chen , Kuo-Hua Tseng , Chang-Ho Liou , Ming-Daw Chen
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摘要: A flat speaker apparatus including a driving circuit module, and thermally conductive connector, with heat dissipating structure is introduced. The includes porous electrode vibrating film. causes the film to vibrate according an audio signal output from module for generating sound. connector connects conduct dissipation. method dissipation of also introduced herein.
lens.org 参考文章(16)
Chang Ho Liou, Wei Chung Lee, Ming Daw Chen, Method and device of manufacturing speaker ,(2010)
Rong-Shen Lee, Yu-Min Lin, Chang-Ho Liou, Ming-Daw Chen, Yu-Wei Huang, Electrode connection structure of speaker unit ,(2008)
Lawrence R. Fincham, Loudspeaker line array configurations and related sound processing ,(2007)
Yi-Jen Chan, Chang-Ho Liou, Kuo-Hua Tseng, Ming-Daw Chen, Flat speaker structure and device ,(2009)
Chang Ho Liou, Ming Daw Chen, Kuo Hua Tseng, Flat loudspeaker structure ,(2010)
Chang-Ho Liou, Ming-Daw Chen, Flat speaker unit and speaker device therewith ,(2009)
Chang-Ho Liou, Ming-Daw Chen, Methods of making speakers ,(2009)
Michael J. Parrella, Piezo speaker for improved passenger cabin audio systems Journal of the Acoustical Society of America. ,vol. 107, pp. 1811- ,(1996) , 10.1121/1.428516
Dar-Ming Chiang, Long-Cheng Cheng, I-Chen Lee, Yen-Ren Chen, Electrostatic electroacoustic transducers ,(2007)
Kuan-Wei Chen, Kuo-Hua Tseng, Chang-Ho Liou, Ming-Daw Chen, Flat speaker structure ,(2009)