Cost, performance, and reliability simulator for optical transceiver modules.
作者： Charles W. Stirk , Nuri Delen , Adam Fedor , Matthew Ball , R. Brian Hooker
DOI: 10.1364/AO.37.006151
关键词:
摘要: The program couple combines simulators for optical performance, mechanical reliability, and production cost under a graphical-user interface to design, simulate, evaluate micro-optomechanical structures. thermal simulator predicts the package temperature distribution on basis of materials geometry as well heat sources, sinks, boundary conditions. is input simulator, which calculates stresses or strains displacements caused by differential expansion. impact efficiency cross talk parameter variations such solder heights, misalignments, wavelength distributions. represents manufacturing process flow final sensitivity yield each step. By means balancing detector coupling yield, cosimulation from domains determines optimum size produce lowest-cost transceiver module.
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