Method of chemically polishing copper and copper alloy
作者： Kazuyoshi Kushibe
DOI:
关键词:
摘要: This invention provides a method of chemically polishing copper and alloys which comprises using solution with one or more members selected from azoles having the structure represented by general formulae ##SPC1## Wherein X, X' X" represent any hydrogen, amino, aminoalkyl containing 1-3 carbon atoms alkyl added to an acid aqueous hydrogen peroxide sulfuric nitric acid.
lens.org 参考文章(6)
John G Poor, Carmelo L Alderuccio, Harold F Jones, Lawrence P Gould, Dissolution of metal with acidified hydrogen peroxide and use as copper etchant in manufacture of printed circuits ,(1963)
O Fujimoto, Method of etching copper and alloys thereof ,(1971)
Richard H Jenks, Etching bath composition ,(1965)
Wisken Adolf Hermann, Etching methods for controlled cleaning and polishing of the surface of magnesium ,(1956)
Y Shibasaki, K Oyama, Composition for etching copper with reduced sideways-etching ,(1972)
R Zeblisky, Peroxy containing compositions ,(1971)